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April 1998
FDS4410 Single N-Channel Logic Level PWM Optimized PowerTrenchTM MOSFET
General Description
This N-Channel Logic Level MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. The MOSFET features faster switching and lower gate charge than other MOSFETs with comparable RDS(ON) specifications. The result is a MOSFET that is easy and safer to drive (even at very high frequencies), and DC/DC power supply designs with higher overall efficiency.
Features
10 A, 30 V. RDS(ON) = 0.0135 @ VGS = 10 V RDS(ON) = 0.0200 @ VGS = 4.5 V.
Optimized for use in switching DC/DC converters with PWM controllers. Very fast switching . Low gate charge (typical 22 nC).
SOT-23
SuperSOTTM-6
SuperSOTTM-8
SO-8
SOT-223
SOIC-16
D D D D
5
4 3 2 1
S F D 10 44
S S S G
6 7 8
SO-8
pin 1
Absolute Maximum Ratings
Symbol Parameter
TA = 25oC unless other wise noted
FDS4410 Units
VDSS VGSS ID PD
Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed Power Dissipation for Single Operation
(Note 1a) (Note 1b) (Note 1c) (Note 1a)
30 20 10 50 2.5 1.2 1 -55 to 150
V V A
W
TJ,TSTG RJA RJC
Operating and Storage Temperature Range
C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case
(Note 1a) (Note 1)
50 25
C/W C/W
FDS4410 Rev.B1
(c) 1998 Fairchild Semiconductor Corporation
Electrical Characteristics (TA = 25 OC unless otherwise noted )
Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS
BVDSS
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Zero Gate Voltage Drain Current
VGS = 0 V, I D = 250 A ID = 250 A, Referenced to 25 C VDS = 24 V, VGS = 0 V TJ = 55C VGS = 20 V, VDS = 0 V VGS = -20 V, VDS= 0 V VDS = VGS, ID = 250 A ID = 250 A, Referenced to 25 oC VGS = 10 V, I D = 10 A TJ =125C VGS = 4.5 V, I D = 9 A
o
30 21 1 10 100 -100
V mV /oC A A nA nA
BVDSS/TJ
IDSS IGSSF IGSSR VGS(th)
Gate - Body Leakage, Forward Gate - Body Leakage, Reverse
(Note 2)
ON CHARACTERISTICS
Gate Threshold Voltage Gate Threshold Voltage Temp. Coefficient Static Drain-Source On-Resistance
1
2 -4.5 0.011 0.018 0.017
3
V mV /oC
VGS(th)/TJ
RDS(ON)
0.0135 0.023 0.02
ID(ON) gFS Ciss Coss Crss tD(on) tr tD(off) tf Qg Qgs Qgd IS VSD
Notes:
On-State Drain Current Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance
(Note 2)
VGS = 10 V, VDS = 5 V VDS = 10 V, I D= 10 A VDS = 15 V, VGS = 0 V, f = 1.0 MHz
50 27 1340 340 125
A S pF pF pF 22 24 60 18 31 ns ns ns ns nC nC nC 2.1 A V
DYNAMIC CHARACTERISTICS
SWITCHING CHARACTERISTICS
Turn - On Delay Time Turn - On Rise Time Turn - Off Delay Time Turn - Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDS= 15 V, I D= 1 A VGS = 10 V , RGEN = 6
12 13 38 10
VDS = 15 V, I D = 10 A, VGS = 10 V
22 5 4
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VGS = 0 V, IS = 2.1 A
(Note 2)
0.73
1.2
1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design.
a. 50OC/W on a 1 in2 pad of 2oz copper.
b. 105OC/W on a 0.04 in2 pad of 2oz copper.
c. 125OC/W on a 0.006 in2 pad of 2oz copper.
Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%.
FDS4410 Rev.B1
Typical Electrical Characteristics
50 I D , DRAIN-SOURCE CURRENT (A) 3 DRAIN-SOURCE ON-RESISTANCE
R DS(on) , NORMALIZED
VGS = 10V 6.0V 5.0V 4.5V 40 4.0V
VGS = 3.5V
2.5
30
2
4.0V 4.5V
20
1.5
5.0V 5.5V 7.0V 10V
3.5V
10
1
0 0 0.5 V
DS
1
1.5
2
2.5
3
0.5 0 10 20 30 40 50 I D , DRAIN CURRENT (A)
, DRAIN-SOURCE VOLTAGE (V)
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.
1.8 DRAIN-SOURCE ON-RESISTANCE 1.6 1.4 1.2 1 0.8 0.6 -50
R DS(ON) , ON-RESISTANCE (OHM)
0.05
I D = 10 A VGS = 10 V
I D = 5A
0.04
R DS(ON) , NORMALIZED
0.03
0.02
TA = 125C
0.01
TA = 25C
-25
0
25
50
75
100
125
150
0 2 4 6 8 10 V GS , GATE TO SOURCE VOLTAGE (V)
TJ , JUNCTION TEMPERATURE (C)
Figure 3. On-Resistance Variation Temperature.
with
Figure 4 . On-Resistance Variation with Gate-to-Source Voltage.
50
IS , REVERSE DRAIN CURRENT (A)
VDS = 5V
I D , DRAIN CURRENT (A) 40
T = -55C A 25C 125C
50 10 1
V GS = 0V
30
TA = 125C
0.1 0.01 0.001 0.0001
25C -55C
20
10
0 2 3 4 5 VGS , GATE TO SOURCE VOLTAGE (V)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
VSD , BODY DIODE FORWARD VOLTAGE (V)
Figure 5 . Transfer Characteristics.
Figure 6 . Body Diode Forward Voltage Variation with Source Current and Temperature.
FDS4410 Rev.B1
Typical Electrical And Thermal Characteristics
10 V GS , GATE-SOURCE VOLTAGE (V) 2000
I D = 10A
8
V DS = 5V 10V
CAPACITANCE (pF)
C iss
1000
15V
6
500
4
C oss
200
2
f = 1 MHz V GS = 0V
0.5 1 2 5
C rss
10 30
0 0 5 10 15 20 25 Q g , GATE CHARGE (nC)
100 0.1
V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate Charge Characteristics.
Figure 8. Capacitance Characteristics.
100 30 ID , DRAIN CURRENT (A) 10 3
T IMI )L (ON DS R
30
100 us 1m s 10m s 100 ms 1s 10s DC
POWER (W)
25 20 15 10 5 0 0.01
SINGLE PULSE R JA =125 C/W T A = 25C
0.5 0.1
VGS = 10V SINGLE PULSE RJA =125C/W TA = 25C
0.1 0.2 V
DS
0.01 0.05
0.5
1
2
5
10
20 30
50
0.1
0.5
1
10
50 100
300
, DRAIN-SOURCE VOLTAGE (V)
SINGLE PULSE TIME (SEC)
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum Power Dissipation.
r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE
1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 0.0001 0.001 0.01 0.1 t1 , TIME (sec) 1
D = 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse P(pk)
R JA (t) = r(t) * R JA R JA = 125C/W
t1
t2
TJ - TA = P * R JA(t) Duty Cycle, D = t1 /t2
10 100 300
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c. Transient thermal response will change depending on the circuit board design.
FDS4410 Rev.B1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM
DISCLAIMER
ISOPLANARTM MICROWIRETM POPTM PowerTrenchTM QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8
TinyLogicTM UHCTM VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.

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